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Model 270 Diagrams

Card Enclosure Diagrams

Locations -- Model 270

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This page includes a table with links to diagrams and tables for Model 270 by feature codes. If you need address information, refer to Addresses -- Model 270.

Table 1. Model 270 diagrams and tables by processor feature code

Find the processor feature code you are working with, and then select the adjacent table or figure for details.

Processor feature code Locations diagram FRU positions and failing components Network Interface Controller (NIC) is in this FRU Processor is in this FRU HSL loop number and port information
22A2, 22A4, 22A5, 2301, 2302, 2422 See Figure 1. Model 270 system unit, processor features 22A2, 22A4, 22A5, 2301, 2302, 2422 (Processor embedded on backplane) See Table 3. FRU locations and failing components for Model 270 (Processor features 22A2, 22A4, 22A5, 2301, 2302, 2422) Embedded in the system unit backplane in position MB1 Embedded in the system unit backplane in position MB1 Loop number 256 has external HSL ports labeled "A0" and "A1"
22A7, 22A8, 22AA, 22AB, 23F4, 23F5, 2423, 2424, 2454 See Figure 2. Model 270 system unit, processor features 22A7, 22A8, 22AA, 22AB, 23F4, 23F5, 2423, 2424, 2454 See Table 5. FRU locations and failing components for Model 270 (Processor features 22A7, 22A8, 22AA, 22AB, 23F4, 23F5, 2423, 2424, 2454) Embedded in the processor card in position M02 Embedded in the processor card in position M02 Loop number 256 has external HSL ports labeled "A0" and "A1"
23E7, 23F0, 23F1, 2452 See Figure 3. Model 270 system unit, processor features 23E7, 23F0, 23F1, 2452 (Processor embedded on backplane) See Table 7. FRU locations and failing components for Model 270 (Processor features 23E7, 23F0, 23F1, 2452) Embedded in the system unit backplane in position MB1 Embedded in the system unit backplane in position MB1 Loop number 256 is an internal loop embedded in the system unit backplane. The loop goes from the NIC, to the embedded HSL I/O bridge, and back to the NIC with no external HSL ports. Loop number 257 has external HSL ports labeled "A0" and "A1"

Figure 1. Model 270 system unit, processor features 22A2, 22A4, 22A5, 2301, 2302, 2422 (Processor embedded on backplane)

Model 270 system unit, processor features 22A2, 22A4, 22A5, 2301, 2302, 2422 (Processor embedded on backplane)

Notes:

  1. The model 270 system unit contains one system PCI bus with one multi-adapter bridge. The bus number is 0001.
  2. There is an embedded CFIOP in the system unit backplane in position MB1.
  3. Memory DIMMS are placed in pairs when more than one DIMM is present. Use the order A-B, C-D, E-F, then G-H.
  4. The following table provides information necessary to identify the IOP to which IOAs are assigned.
    • The left column indicates the domain in which IOA assignment is allowed.
    • The right column is used to determine the IOP to which an IOA is assigned.
    • The first position in the list must be an IOP. The remaining positions may be IOPs or IOAs. IOAs are assigned to the first IOP located to their left in the list. Although IOAs can be manually reassigned using SST/DST, the IOA assignments return to the default order after each IPL.

      Table 2. IOA assignment rules for MB1, C01-C07

      Multi-adapter bridge domain / PCI bridge set IOA assignment rules
      MB1, C01 - C07 MB1, C07, C01, C06, C05, C04, C03, C02

Table 3. FRU locations and failing components for Model 270 (Processor features 22A2, 22A4, 22A5, 2301, 2302, 2422)

Position FRU name Possible failing component Type, CCIN, or part number (use the Type, model, and part number list to determine the part number when the type or CCIN are given.) Remove and replace/recovery procedure
C01 PCI card IOA See the Type, model, and part number list. Go to Models 270, 800, and 810 - Cards (dedicated).
C02 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards (dedicated).
C03 (Short if 2890 IXS in C04) PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
 Go to Models 270, 800, and 810 - Cards (dedicated).
C04 PCI card
  1. Integrated xSeries(TM) Server (IXS)
  2. IOP
  3. IOA
  1. CCIN is 2890 or 2892
  2. CCIN is 2842, 2843, or 2844
  3. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards (dedicated).
C05 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
 Go to Models 270, 800, and 810 - Cards (dedicated).
C06 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
 Go to Models 270, 800, and 810 - Cards (dedicated).
C07 PCI card IOA See the Type, model, and part number list. Go to Models 270, 800, and 810 - Cards (dedicated).
MB1 System unit backplane
  • Card enclosure or backplane
  • Clock card
  • SPCN card
  • HSL I/O bridge
  • Processor regulator
  • Memory riser card
  • System unit backplane
  • HSL ring connection
  • HSL controller
  • Processor
  • Service processor
  • IOP
  • Multi-adapter bridge (all)
2249

Note: Embedded IOP (type 284D) is exchanged with the system unit backplane.

OR

224A

Note: Embedded IOP (type 286F) is exchanged with the system unit backplane.

Go to Models 270, 800, and 810 - System unit backplane - MB1.
D01 to D06 Disk unit Disk unit See the Type, model, and part number list. Go to Recovery procedures.
D07 Optical device Optical device See the Type, model, and part number list. Go to Models 270, 800, and 810 - Removable media - D07 and D08.
D08 Tape unit Tape unit See the Type, model, and part number list. Go to Models 270, 800, and 810 - Removable media - D07 and D08.
P01 Power supply Power supply See Final assembly -- Models 270, 800, and 810. Go to Models 270, 800, and 810 - Power supply - P01
B01, B02 AMD Air moving device (AMD) See Final assembly -- Models 270, 800, and 810. Go to Models 270, 800, and 810 - Air moving device - B01 and B02.
NB1 Control panel Control panel 247D Go to Models 270, 800, and 810 - Control panel - NB1.
R01 Processor power regulator Processor power regulator 04N4276 Go to Models 270, 800, and 810 - Processor regulator - R01
DB1, DB2, DB3 Device board Device board See the Type, model, and part number list. Go to Models 270, 800, and 810 - Device board - DB1, DB2, and DB3
A Memory card Memory card 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Memory - A through H.
B Memory card Memory card 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Memory - A through H
C Memory card Memory card 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Memory - A through H
D Memory card Memory card 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Memory - A through H
E Memory card Memory card 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Memory - A through H
F Memory card Memory card 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Memory - A through H
G Memory card Memory card 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Memory - A through H
H Memory card Memory card 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Memory - A through H
Time of day (TOD) battery on MB1 TOD TOD 16G8095 Go to Models 270, 800, and 810 - Time of day (TOD) battery
HSL cables on the HSL ports HSL cable HSL connection See the Type, model, and part number list. Go to HSL cables - Concurrent.

Figure 2. Model 270 system unit, processor features 22A7, 22A8, 22AA, 22AB, 23F4, 23F5, 2423, 2424, 2454

Model 270 system unit, processor features 22A7, 22A8, 22AA, 22AB, 23F4, 23F5, 2423, 2424, 2454

Notes:

  1. The model 270 system unit contains one system PCI bus with one multi-adapter bridge. The bus number is 0001.
  2. There is an embedded CFIOP in the System Unit Backplane in position MB1.
  3. The following table provides information necessary to identify the IOP to which IOAs are assigned. The left column indicates the domain in which IOA assignment is allowed. The right column is used to determine the IOP to which an IOA is assigned. The first position in the list must be an IOP. The remaining positions may be IOPs or IOAs. IOAs are assigned to the first IOP located to their left in the list. Although IOAs can be manually reassigned using SST/DST, the IOA assignments return to the default order after each IPL.

    Table 4. IOA assignment rules for MB1, C01-C07

    Multi-adapter bridge domain / PCI bridge set IOA assignment rules
    MB1, C01 - C07 MB1, C07, C01, C06, C05, C04, C03, C02

Table 5. FRU locations and failing components for Model 270 (Processor features 22A7, 22A8, 22AA, 22AB, 23F4, 23F5, 2423, 2424, 2454)

Position FRU name Possible failing component Type, CCIN, or part number (use the Type, model, and part number list to determine the part number when the type or CCIN are given.) Remove and replace/recovery procedure
C01 PCI card IOA See the Type, model, and part number list. Go to Models 270, 800, and 810 - Cards - Concurrent.
C02 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards - Concurrent.
C03 (Short if 2890 IXS in C04) PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards - Concurrent.
C04 PCI card
  1. Integrated xSeries Server (IXS)
  2. IOP
  3. IOA
  1. CCIN is 2890 or 2892
  2. CCIN is 2842, 2843, or 2844
  3. See the Type, model, and part number list.
 Go to Models 270, 800, and 810 - Cards - Concurrent.
C05 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list
Go to Models 270, 800, and 810 - Cards - Concurrent.
C06 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards - Concurrent.
C07 PCI card IOA See the Type, model, and part number list. Go to Models 270, 800, and 810 - Cards - Concurrent.
MB1 System unit backplane
  1. Service processor
  2. IOP
  3. Card enclosure or backplane
  4. Clock card
  5. SPCN card
  6. HSL I/O bridge
  7. System unit backplane
  8. HSL ring connection
  9. Multi-adapter bridge (all)
282F

Note: Embedded IOP (type 284E) is exchanged with the system unit backplane, 282F.

Go to Models 270, 800, and 810 - System unit backplane - MB1
D01 to D06 Disk unit Disk unit See the Type, model, and part number list. Go to Recovery procedures.
D07 Optical device Optical device See the Type, model, and part number list. Go to Models 270, 800, and 810 - Removable media - D07 and D08.
D08 Tape unit Tape unit See the Type, model, and part number list. Go to Models 270, 800, and 810 - Removable media - D07 and D08.
P01 Power supply Power supply See Final assembly -- Models 270, 800, and 810. Go to Models 270, 800, and 810 - Power supply - P01
B01, B02 AMD Air moving device (AMD) See Final assembly -- Models 270, 800, and 810 System Unit Expansion. Go to Models 270, 800, and 810 - AMD - B01 and B02
NB1 Control panel Control panel 247D Go to Models 270, 800, and 810 - Control panel - NB1
DB1, DB2, DB3 Device board Device board See the Type, model, and part number list. Go to Models 270, 800, and 810 - Device board - DB1, DB2, and DB3
M01 Memory Riser Card Memory Riser Card 2884 Go to Models 270, 800, and 810 - Cards (dedicated)
M01 daughter cards Memory DIMM See Figure 1. 2884 Memory card in the Memory locations and placement rules topic. 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Cards (dedicated)
M02 Processor card
  1. Processsor
  2. Network Interface Controller (NIC)
24A0 (1-way)

24A2 (2-way)

25BD (2-way)

 Go to Models 270, 800, and 810 - Cards (dedicated)
R01 Processor regulator card Processor regulator
  • All except type 24A2 and 25BD, use part number 04N4276
  • 24A2 (2-way)
  • 25BD (2-way)
 Go to Models 270, 800, and 810 - Processor regulator - R01
M02 daughter card Memory DIMM See Figure 2. Processor card with DIMM memory in the Memory locations and placement rules topic. 3022, 3024, 3025, 3026, 3027, 3029 Go to Models 270, 800, and 810 - Cards (dedicated)
Time of day (TOD) battery on MB1 TOD TOD 16G8095 Go to Models 270, 800, and 810 - Time of day (TOD) battery
HSL cables on the HSL ports HSL cable HSL connection See the Type, model, and part number list. Go to HSL cables - Concurrent.

Figure 3. Model 270 system unit, processor features 23E7, 23F0, 23F1, 2452 (Processor embedded on backplane)

Figure 3. Model 270 system unit, processor features 23E7, 23F0, 23F1, 2452 (Processor embedded on backplane)

Notes:

  1. The model 270 system unit contains one system PCI bus with one multi-adapter bridge. The bus number is 0001.
  2. There is an embedded CFIOP in the system unit backplane in position MB1.
  3. Memory DIMMS are placed in pairs when more than one DIMM is present. Use the order A-B, C-D, E-F, then G-H.
  4. The following table provides information necessary to identify the IOP to which IOAs are assigned. The left column indicates the domain in which IOA assignment is allowed. The right column is used to determine the IOP to which an IOA is assigned. The first position in the list must be an IOP. The remaining positions may be IOPs or IOAs. IOAs are assigned to the first IOP located to their left in the list. Although IOAs can be manually reassigned using SST/DST, the IOA assignments return to the default order after each IPL.

    Table 6. IOA assignment rules for MB1, C01-C07

    Multi-adapter bridge domain / PCI bridge set IOA assignment rules
    MB1, C01 - C07 MB1, C07, C01, C06, C05, C04, C03, C02

Table 7. FRU locations and failing components for Model 270 (Processor features 23E7, 23F0, 23F1, 2452)

Position FRU name Possible failing component Type, CCIN, or part number (use the Type, model, and part number list to determine the part number when the type or CCIN are given.) Remove and replace/recovery procedure
C01 PCI card IOA See the Type, model, and part number list. Go to Models 270, 800, and 810 - Cards (dedicated).
C02 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards (dedicated).
C03 (Short if IXS in C04) PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards (dedicated).
C04 PCI card
  1. Integrated xSeries Server (IXS)
  2. IOP
  3. IOA
  1. CCIN is 2890 or 2892
  2. CCIN is 2842, 2843, or 2844
  3. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards (dedicated).
C05 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards (dedicated).
C06 PCI card
  1. IOP
  2. IOA
  1. CCIN is 2842, 2843, or 2844
  2. See the Type, model, and part number list.
Go to Models 270, 800, and 810 - Cards (dedicated).
C07 PCI card IOA See the Type, model, and part number list. Go to Models 270, 800, and 810 - Cards (dedicated).
MB1 System unit backplane
  • Card enclosure or backplane
  • Clock card
  • SPCN card
  • HSL I/O bridge
  • Processor regulator
  • Memory riser card
  • System unit backplane
  • HSL ring connection
  • HSL controller
  • Processor
  • Service processor
  • IOP
  • Multi-adapter bridge (all)
25B9

Note: Embedded IOP (type 286C) is exchanged with the system unit backplane.

OR

25BA

Note: Embedded IOP (type 286D) is exchanged with the system unit backplane.

Go to Models 270, 800, and 810 - System unit backplane - MB1.
D01 to D06 Disk unit Disk unit See the Type, model, and part number list. Go to Recovery procedures.
D07 Optical device Optical device See the Type, model, and part number list. Go to Models 270, 800, and 810 - Removable media - D07 and D08.
D08 Tape unit Tape unit See the Type, model, and part number list. Go to Models 270, 800, and 810 - Removable media - D07 and D08.
P01 Power supply Power supply See Final assembly -- Models 270, 800, and 810. Go to Models 270, 800, and 810 - Power supply - P01
B01, B02 AMD AMD See Final assembly -- Models 270, 800, and 810 System Unit Expansion. Go to Models 270, 800, and 810 - AMD - B01 and B02.
NB1 Control panel Control panel 247D Go to Models 270, 800, and 810 - Control panel - NB1.
R01 Processor regulator card Processor regulator 04N4276 Go to Models 270, 800, and 810 - Processor regulator - R01
DB1, DB2, DB3 Device board Device board See the Type, model, and part number list. Go to Models 270, 800, and 810 - Device board - DB1, DB2, and DB3
A through H Memory card Memory card 3032, 3033, 3034 Go to Models 270, 800, and 810 - Memory - A through H.
Time of day (TOD) battery on MB1 TOD TOD 16G8095 Go to Models 270, 800, and 810 - Time of day (TOD) battery
HSL cables on the HSL ports HSL cable HSL connection See the Type, model, and part number list. Go to HSL cables - Concurrent.

Figure 4. Model 270 FC 7104 system unit expansion

Model 270 FC 7104 system unit expansion

Table 8. FRU locations and failing components for the Model 270 system unit expansion

Position FRU name Possible failing component Type, CCIN, or part number (use the Type, model, and part number list to determine the part number when the type or CCIN are given.) Remove and replace/recovery procedure
D09 to D20 Disk unit Disk unit See the Type, model, and part number list. Go to Recovery procedures.
DB2 and DB3 Device board Disk unit backplane See the Type, model, and part number list. Go to Models 270, 800, and 810 - Device board - DB1, DB2, and DB3.
P02 Power supply Power supply See Final assembly -- Models 270, 800, and 810 System Unit Expansion. Go to Models 270, 800, and 810 - Power supply - P02.
B03 AMD AMD 04N5698 Go to Models 270, 800, and 810 - Air moving device - B03.

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Last modified: November 7, 2011

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